28 Jan Make device testing quick and easy with Flip-Top™ Ball Grid Array test sockets
BGA and LGA device testing is tremendously important, but it can be time consuming to solder or apply external hold-downs on the PC board.
Luckily, Advanced Interconnections has removed a lot of testing stress with their flip-top ball grid array socketing systems. See them in action in the following YouTube video:
Test socket models are available in 1.27mm, 1.00mm, and .5mm pitches. Find out more about model specifications on Advanced’s site:
Advanced Interconnections offers a wealth of options in image sensor sockets to consider.
HHP is honored to serve as a manufacturer’s rep for Advanced Interconnections.