Mezza-pede® 1.0mm pitch SMT Connectors from Advanced are designed for low profile board-to-board or flex cable-to-board applications where long-term reliability and a compact size are required.
Advanced Interconnections’ Build-a-Part tool and BGA Footprint Finder remove a lot of the hassle out of finding the right part for your application.
BGA Socket Adapter Systems from Advanced Interconnections Corp. convert surface mount device packages to thru-hole (pinned) assemblies, making it easy to plug and unplug SMT packages, such as BGA, LGA, or CSP.
1.27mm pitch B2B® SMT Connectors, featuring solder ball terminals, provide a highly reliable method to define stack height between two PC boards. Their compact design conserves board space by combining many signal, ground, and power pins in a dense area.
Quickly build a part number for the exact IC socket, adapter, or board-to-board connector required for your application in just a few clicks with the Advanced Interconnections’ Build-A-Part tool. Learn how to use the Build-A-Part Number tool in this informative video.
Advanced Interconnections’ high quality, dependable Single In-line Package (SIP) Sockets, Adapters, and Headers are designed with robust screw-machined terminals for superior performance.
Work directly with experienced product engineers to create a customized connector, or use the online Build-A-Part™ tool to configure standard designs to meet your application.
BGA and LGA device testing is tremendously important, but it can be time consuming to solder or apply external hold-downs on the PC board.
Image sensors are such an integral part of the modern world. They’re part everything from astronomy, to medicine, to our consumer electronics.
Ideal for socketing heat sensitive devices or board-to-board mating. Simply solder to the board and peel away the polyimide film for improved air flow and solder joint inspection.